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Phoenix Contact 1779530
Phoenix ContactOfficial Distributor

By Phoenix Contact

SKU
MPN
MCV 1,5/10-G-3,5 P26 THRR56
Weight
0.005 kg
Series MCV

MCV 1,5/10-G-3,5 P26 THRR56 - PCB header

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: MCV 1,5/..-G-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 56 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads

  • Designed for integration into the SMT soldering process
  • Vertical connection enables multi-row arrangement on the PCB
  • Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Technical Specifications

Product properties

Product familyMCV 1,5/..-G-THR
Product lineCOMBICON Connectors S
TypeComponent suitable for through hole reflow
Number of Positions10
Pitch3.5 mm
Number of Connections10
Number of rows1
Number of potentials10
Mounting flangewithout
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties

Nominal current IN8 A
Nominal voltage UN160 V
Degree of pollution3
Contact resistance1.6 mΩ
Rated voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)250 V
Rated surge voltage (II/2)2.5 kV

Mounting

Mounting TypeTHR soldering
Pin layoutLinear pinning

Processing notes

ProcessReflow/wave soldering
Moisture Sensitive LevelMSL 1
Classification temperature Tc260 °C
Solder cycles in the reflow3

Material data - contact

NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact MaterialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer)Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer)Nickel (1.3 - 3 µm Ni)

Material data - housing

Color (Housing)black (9005)
Insulating materialLCP
Insulating material groupIIIa
CTI according to IEC 60112175
Flammability rating according to UL 94V0

Dimensions

Pitch3.5 mm
Width [w]36.4 mm
Height [h]11.8 mm
Length [l]6.9 mm
Installed height9.2 mm
Solder pin length [P]2.6 mm
Pin dimensions0.8 x 0.8 mm

PCB design

Hole diameter1.4 mm

Visual inspection

SpecificationIEC 60512-1-1:2002-02
ResultTest passed

Dimension check

SpecificationIEC 60512-1-2:2002-02
ResultTest passed

Resistance of inscriptions

SpecificationIEC 60068-2-70:1995-12
ResultTest passed

Polarization and coding

SpecificationIEC 60512-13-5:2006-02
ResultTest passed

Contact holder in insert

SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N		Test passed

Insertion and withdrawal forces

ResultTest passed
No. of cycles25
Insertion strength per pos. approx.9 N
Withdraw strength per pos. approx.7 N

Thermal test | Test group C

SpecificationIEC 60512-5-1:2002-02
Tested number of positions20

Insulation resistance

SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions> 5 MΩ

Air clearances and creepage distances |

SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 175
Rated insulation voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
minimum clearance value - non-homogenous field (III/3)1.5 mm
minimum creepage distance (III/3)2.5 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)250 V
Rated surge voltage (II/2)2.5 kV
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum creepage distance (II/2)2.5 mm

Vibration test

SpecificationIEC 60068-2-6:2007-12
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h

Durability test

SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level2.95 kV
Contact resistance R11.6 mΩ
Contact resistance R21.7 mΩ
Insertion/withdrawal cycles25

Climatic test

SpecificationISO 6988:1985-02
Corrosive stress0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV

Ambient conditions

Ambient Temperature (Operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications

Type of packaging56 mm wide tape
[W] tape width56 mm
[W2] coil overall dimension62.4 mm
[A] coil diameter330 mm
Outer packaging typeTransparent-Bag
ESD level(D) electrostatically conductive
SpecificationDIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

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Additional Information

Pack Size1
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