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Phoenix ContactOfficial Distributor

By Phoenix Contact

SKU
MPN
MCV 1,5/10-GF-3,81P26AUTHRRNZ1
Weight
0.007 kg
Series MCV

MCV 1,5/10-GF-3,81P26AUTHRRNZ1 - PCB header

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: 72 mm wide tape

  • Designed for integration into the SMT soldering process
  • Screwable flange for superior mechanical stability
  • Vertical connection enables multi-row arrangement on the PCB
  • Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
  • Gold-plated contacts ensure transfer quality remains stable over the long term
Technical Specifications

Product properties

Product familyMCV 1,5/..-GF-THR
Product lineCOMBICON Connectors S
Number of Positions10
Pitch3.81 mm
Number of Connections10
Number of rows1
Number of potentials10
Mounting flangeThreaded flange
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties

Nominal current IN8 A
Nominal voltage UN160 V
Degree of pollution3
Contact resistance1.6 mΩ
Rated voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)250 V
Rated surge voltage (II/2)2.5 kV

Mounting

Mounting TypeTHR soldering
Pin layoutLinear pinning

Flange

Tightening torque0.3 Nm

Processing notes

ProcessReflow/wave soldering
Moisture Sensitive LevelMSL 1
Classification temperature Tc245 °C
Solder cycles in the reflow3

Material data - contact

NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact MaterialCu alloy
Surface characteristicspartially gold-plated
Metal surface contact area (top layer)Gold (0.8 - 1.4 µm Au)
Metal surface contact area (middle layer)Nickel (2 - 4 µm Ni)
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer)Nickel (2 - 4 µm Ni)

Material data - housing

Color (Housing)black (9005)
Insulating materialLCP
Insulating material groupIIIa
CTI according to IEC 60112175
Flammability rating according to UL 94V0

Dimensions

Pitch3.81 mm
Width [w]48.49 mm
Height [h]11.8 mm
Length [l]7.25 mm
Installed height9.2 mm
Solder pin length [P]2.6 mm

PCB design

Hole diameter1.4 mm

Visual inspection

SpecificationIEC 60512-1-1:2002-02
ResultTest passed

Dimension check

SpecificationIEC 60512-1-2:2002-02
ResultTest passed

Resistance of inscriptions

SpecificationIEC 60068-2-70:1995-12
ResultTest passed

Polarization and coding

SpecificationIEC 60512-13-5:2006-02
ResultTest passed

Contact holder in insert

SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed

Insertion and withdrawal forces

ResultTest passed
No. of cycles100
Insertion strength per pos. approx.4 N
Withdraw strength per pos. approx.3 N

Thermal test | Test group C

SpecificationIEC 60512-5-1:2002-02
Tested number of positions12

Insulation resistance

SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions1012 Ω

Air clearances and creepage distances |

SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 175
Rated insulation voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
minimum clearance value - non-homogenous field (III/3)1.5 mm
minimum creepage distance (III/3)2.5 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)250 V
Rated surge voltage (II/2)2.5 kV
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum creepage distance (II/2)2.5 mm

Vibration test

SpecificationIEC 60068-2-6:2007-12
Frequency10 - 500 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 500 Hz)
Test duration per axis2 h

Durability test

SpecificationIEC 60512-5:1992-08
Impulse withstand voltage at sea level2.95 kV
Contact resistance R11.6 mΩ
Contact resistance R21.8 mΩ
Insertion/withdrawal cycles100

Climatic test

SpecificationDIN 50018-EN:1997-06
Corrosive stress1.0 dm3 SO2 on 300 dm3/40 °C/3 cycles
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV

Shocks

SpecificationIEC 60068-2-27:2008-02
Pulse shapeSemi-sinusoidal
Acceleration30g
Shock duration18 ms
Test directionsX-, Y- and Z-axis (pos. and neg.)

Ambient conditions

Ambient Temperature (Operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications

Type of packaging72 mm wide tape
[W] tape width72 mm
[W2] coil overall dimension78.4 mm
[A] coil diameter330 mm
Outer packaging typeTransparent-Bag
ESD level(D) electrostatically conductive
SpecificationDIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

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