MCV 1,5/10-GF-3,81P26AUTHRRNZ4 - PCB header
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: 72 mm wide tape
- Designed for integration into the SMT soldering process
- Screwable flange for superior mechanical stability
- Vertical connection enables multi-row arrangement on the PCB
- Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
- Gold-plated contacts ensure transfer quality remains stable over the long term
Product properties
Product family | MCV 1,5/..-GF-THR |
Product line | COMBICON Connectors S |
Number of Positions | 10 |
Pitch | 3.81 mm |
Number of Connections | 10 |
Number of rows | 1 |
Number of potentials | 10 |
Mounting flange | Threaded flange |
Pin layout | Linear pinning |
Solder pins per potential | 1 |
Electrical properties
Nominal current IN | 8 A |
Nominal voltage UN | 160 V |
Degree of pollution | 3 |
Contact resistance | 1.6 mΩ |
Rated voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
Rated voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
Rated voltage (II/2) | 250 V |
Rated surge voltage (II/2) | 2.5 kV |
Mounting
Mounting Type | THR soldering |
Pin layout | Linear pinning |
Flange
Tightening torque | 0.3 Nm |
Processing notes
Process | Reflow/wave soldering |
Moisture Sensitive Level | MSL 1 |
Classification temperature Tc | 245 °C |
Solder cycles in the reflow | 3 |
Material data - contact
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact Material | Cu alloy |
Surface characteristics | partially gold-plated |
Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
Material data - housing
Color (Housing) | black (9005) |
Insulating material | LCP |
Insulating material group | IIIa |
CTI according to IEC 60112 | 175 |
Flammability rating according to UL 94 | V0 |
Dimensions
Pitch | 3.81 mm |
Width [w] | 48.49 mm |
Height [h] | 11.8 mm |
Length [l] | 7.25 mm |
Installed height | 9.2 mm |
Solder pin length [P] | 2.6 mm |
PCB design
Hole diameter | 1.4 mm |
Visual inspection
Specification | IEC 60512-1-1:2002-02 |
Result | Test passed |
Dimension check
Specification | IEC 60512-1-2:2002-02 |
Result | Test passed |
Resistance of inscriptions
Specification | IEC 60068-2-70:1995-12 |
Result | Test passed |
Polarization and coding
Specification | IEC 60512-13-5:2006-02 |
Result | Test passed |
Contact holder in insert
Specification | IEC 60512-15-1:2008-05 |
Contact holder in insert Requirements >20 N | Test passed |
Insertion and withdrawal forces
Result | Test passed |
No. of cycles | 100 |
Insertion strength per pos. approx. | 4 N |
Withdraw strength per pos. approx. | 3 N |
Thermal test | Test group C
Specification | IEC 60512-5-1:2002-02 |
Tested number of positions | 12 |
Insulation resistance
Specification | IEC 60512-3-1:2002-02 |
Insulation resistance, neighboring positions | 1012 Ω |
Air clearances and creepage distances |
Specification | IEC 60664-1:2007-04 |
Insulating material group | IIIa |
Comparative tracking index (IEC 60112) | CTI 175 |
Rated insulation voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
minimum creepage distance (III/3) | 2.5 mm |
Rated insulation voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
minimum creepage distance (III/2) | 1.6 mm |
Rated insulation voltage (II/2) | 250 V |
Rated surge voltage (II/2) | 2.5 kV |
minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
minimum creepage distance (II/2) | 2.5 mm |
Vibration test
Specification | IEC 60068-2-6:2007-12 |
Frequency | 10 - 500 - 10 Hz |
Sweep speed | 1 octave/min |
Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
Acceleration | 5g (60.1 Hz ... 500 Hz) |
Test duration per axis | 2 h |
Durability test
Specification | IEC 60512-5:1992-08 |
Impulse withstand voltage at sea level | 2.95 kV |
Contact resistance R1 | 1.6 mΩ |
Contact resistance R2 | 1.8 mΩ |
Insertion/withdrawal cycles | 100 |
Climatic test
Specification | DIN 50018-EN:1997-06 |
Corrosive stress | 1.0 dm3 SO2 on 300 dm3/40 °C/3 cycles |
Thermal stress | 100 °C/168 h |
Power-frequency withstand voltage | 1.39 kV |
Shocks
Specification | IEC 60068-2-27:2008-02 |
Pulse shape | Semi-sinusoidal |
Acceleration | 30g |
Shock duration | 18 ms |
Test directions | X-, Y- and Z-axis (pos. and neg.) |
Ambient conditions
Ambient Temperature (Operation) | -40 °C ... 100 °C (dependent on the derating curve) |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
Type of packaging | 72 mm wide tape |
[W] tape width | 72 mm |
[W2] coil overall dimension | 78.4 mm |
[A] coil diameter | 330 mm |
Outer packaging type | Transparent-Bag |
ESD level | (D) electrostatically conductive |
Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Why Proax for Phoenix Contact 1798919?
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Pack Size | 1 |
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- 1763931 - PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: 72 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads
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