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Phoenix ContactOfficial Distributor

By Phoenix Contact

SKU
MPN
EMSTBVA 2,5/24-G-5,08
Weight
0.01 kg
This product is Not Cancellable/Not Returnable
Series EMSTBVA

EMSTBVA 2,5/24-G-5,08 - PCB header

PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 24, number of rows: 1, number of positions: 24, number of connections: 24, product range: EMSTBVA 2,5/..-G, pitch: 5.08 mm, mounting: Press-in technology, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

  • Long-term stable press-in connection ensures high holding force without thermal load
  • Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
  • Vertical connection enables multi-row arrangement on the PCB
  • Closed contour for optimum stability of the plug-in connection
Technical Specifications

Product properties

Product familyEMSTBVA 2,5/..-G
Product lineCOMBICON Connectors M
TypeStandard
Number of Positions24
Pitch5.08 mm
Number of Connections24
Number of rows1
Number of potentials24
Mounting flangewithout
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties

Nominal current IN12 A
Nominal voltage UN320 V
Degree of pollution3
Contact resistance1.1 mΩ
Rated voltage (III/3)200 V
Rated surge voltage (III/3)4 kV
Rated voltage (III/2)320 V
Rated surge voltage (III/2)4 kV
Rated voltage (II/2)320 V
Rated surge voltage (II/2)4 kV

Mounting

Mounting TypePress-in technology
Pin layoutLinear pinning

Material data - contact

NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact MaterialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (1 - 2 µm Sn)
Metal surface contact area (middle layer)Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (1 - 2 µm Sn)
Metal surface soldering area (middle layer)Nickel (2 - 3 µm Ni)

Material data - housing

Color ()()
Insulating materialPBT
Insulating material groupIIIa
CTI according to IEC 60112225
Flammability rating according to UL 94V0

Notes

Notes on operationIn accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load.

Dimensions

Pitch5.08 mm
Width [w]123.92 mm
Height [h]15.9 mm
Length [l]8.6 mm
Installed height12 mm
Solder pin length [P]3.9 mm

PCB design

Hole diameter1.6 mm

Insertion and withdrawal forces

ResultTest passed
No. of cycles25
Insertion strength per pos. approx.5 N
Withdraw strength per pos. approx.4 N

Insulation resistance

SpecificationIEC 60512-2:1985-00
Insulation resistance, neighboring positions1012 Ω

Air clearances and creepage distances |

SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 225
Rated insulation voltage (III/3)200 V
Rated surge voltage (III/3)4 kV
minimum clearance value - non-homogenous field (III/3)3 mm
minimum creepage distance (III/3)3.2 mm
Rated insulation voltage (III/2)320 V
Rated surge voltage (III/2)4 kV
minimum clearance value - non-homogenous field (III/2)3 mm
minimum creepage distance (III/2)3.2 mm
Rated insulation voltage (II/2)320 V
Rated surge voltage (II/2)4 kV
minimum clearance value - non-homogenous field (II/2)3 mm
minimum creepage distance (II/2)3.2 mm

Vibration test

SpecificationIEC 60068-2-6:1982 + AMD 2:1985
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h

Durability test

SpecificationDIN VDE 0627:1993-05
Impulse withstand voltage at sea level4.8 kV
Contact resistance R11.1 mΩ
Contact resistance R21.5 mΩ
Insertion/withdrawal cycles25

Climatic test

SpecificationDIN VDE 0627:1993-05
Corrosive stress0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168  h
Power-frequency withstand voltage2.21 kV

Ambient conditions

Ambient Temperature (Operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications

Type of packagingpacked in cardboard
Accessories

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Additional Information
Pack Size50
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