The figure shows the 10-pos. version
1156888
Official DistributorSKU
PHX1156888
MPN
FQ 2,54D/ 20-SV-1020-1-BT
Weight
0.003 kg
Series FQ
FQ 2,54D/ 20-SV-1020-1-BT - Female strip
SMD socket, nominal current: 3 A, test voltage: 500 V AC, number of positions: 20, pitch: 2.54 mm, color: black, contact surface: Au, contact connection type: Socket, mounting: SMD soldering
- Reliable mechanical and electrical connections thanks to the double-sided contact system
- Designed for integration into the SMT soldering process
- Clear and cost-optimized design
- Suitable for a multitude of applications
- Stacked, coplanar or orthogonal PCB connections enable maximum flexibility in the device
Documents
Technical Specifications
Notes
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
Product properties
| Product family | FQ 2,54D/...-SV |
| Number of Positions | 20 |
| Pitch | 2.54 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
Electrical properties
| Nominal current IN | 3 A (at 20°C 80-pos.) |
| Contact resistance | 20 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003-05 |
Dimensions
| Pitch | 2.54 mm |
| Width [w] | 25.8 mm |
| Height [h] | 11.2 mm |
| Length [l] | 7.9 mm |
| Installed height | 9.8 mm |
Application
| Contact cover | 0.4 mm |
| Stack height | 13.6 mm Tolerance: +1.3 mm (in combination with Range of articles:FQ 2,54D/...-PV) |
| Wipe length | 1.3 mm |
PCB design
| Pad geometry | 1.04 x 3.38 mm |
Material data - contact
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact Material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
Material data - housing
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
Connection 1
| Insulating material | PA |
| CTI according to IEC 60112 | 600 |
Thermal test | Test group C
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 80 |
Insulation resistance
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 1 GΩ |
Air clearances and creepage distances |
| Insulating material group | I |
| Minimum value for clearance and creepage distance | 0.4 mm |
Insertion and withdrawal forces
| Result | Test passed |
| No. of cycles | 100 |
| Insertion strength per pos. approx. | 2.9 N |
| Withdraw strength per pos. approx. | 2.9 N |
Visual inspection
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
Dimension check
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
Vibration test
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 55 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Acceleration | 181 m/s² |
| Test duration per axis | 2 h |
| Test directions | X-, Y- and Z-axis |
Durability test
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 20 mΩ |
| Contact resistance R2 | 30 mΩ |
| Insertion/withdrawal cycles | 100 |
| Insulation resistance, neighboring positions | > 1 GΩ |
Ambient conditions
| Ambient Temperature (Operation) | -40 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Mounting
| Mounting Type | SMD soldering |
| Pin layout | Linear pad geometry |
Processing notes
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
Packaging specifications
| Type of packaging | Tube magazine |
Why Proax for Phoenix Contact 1156888?
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Additional Information
| Pack Size | 190 |
