
1963544
MCV 0,5/ 3-G-2,5 THT - PCB header
PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads
- Designed for integration into the SMT soldering process
 - Vertical connection enables multi-row arrangement on the PCB
 
Product properties
| Product family | MCV 0,5/..-G-THT | 
| Product line | COMBICON Connectors XS | 
| Type | Component suitable for through hole reflow | 
| Number of Positions | 3 | 
| Pitch | 2.5 mm | 
| Number of Connections | 3 | 
| Number of rows | 1 | 
| Number of potentials | 3 | 
| Mounting flange | without | 
| Pin layout | Linear pinning | 
| Solder pins per potential | 1 | 
Electrical properties
| Nominal current IN | 4 A | 
| Nominal voltage UN | 160 V | 
| Degree of pollution | 3 | 
| Contact resistance | 2 mΩ | 
| Rated voltage (III/3) | 32 V | 
| Rated surge voltage (III/3) | 1.5 kV | 
| Rated voltage (III/2) | 160 V | 
| Rated surge voltage (III/2) | 2.5 kV | 
| Rated voltage (II/2) | 160 V | 
| Rated surge voltage (II/2) | 2.5 kV | 
Mounting
| Mounting Type | THR soldering | 
| Pin layout | Linear pinning | 
Processing notes
| Process | Reflow/wave soldering | 
| Moisture Sensitive Level | MSL 3 | 
| Classification temperature Tc | 245 °C | 
| Solder cycles in the reflow | 3 | 
Material data - contact
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 | 
| Contact Material | Cu alloy | 
| Surface characteristics | Tin-plated | 
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) | 
| Metal surface contact area (middle layer) | Nickel (1 - 3 µm Ni) | 
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) | 
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) | 
Material data - housing
| Color (Housing) | black (9005) | 
| Insulating material | PA | 
| Insulating material group | IIIa | 
| CTI according to IEC 60112 | 250 | 
| Flammability rating according to UL 94 | V0 | 
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 | 
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 | 
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C | 
Dimensions
| Pitch | 2.5 mm | 
| Width [w] | 9.4 mm | 
| Height [h] | 10.1 mm | 
| Length [l] | 8.1 mm | 
| Installed height | 10.1 mm | 
| Solder pin length [P] | 3.5 mm | 
| Pin dimensions | 0.8 x 0.8 mm | 
PCB design
| Pin spacing | 2.50 mm | 
| Hole diameter | 1.4 mm | 
Visual inspection
| Specification | IEC 60512-1-1:2002-02 | 
| Result | Test passed | 
Dimension check
| Specification | IEC 60512-1-2:2002-02 | 
| Result | Test passed | 
Resistance of inscriptions
| Specification | IEC 60068-2-70:1995-12 | 
| Result | Test passed | 
Polarization and coding
| Specification | IEC 60512-13-5:2006-02 | 
| Result | Test passed | 
Contact holder in insert
| Specification | IEC 60512-15-1:2008-05 | 
| Contact holder in insert Requirements >20 N  | Test passed | 
Insertion and withdrawal forces
| Result | Test passed | 
| No. of cycles | 25 | 
| Insertion strength per pos. approx. | 8 N | 
| Withdraw strength per pos. approx. | 6 N | 
Thermal test | Test group C
| Specification | IEC 60512-5-1:2002-02 | 
| Tested number of positions | 12 | 
Insulation resistance
| Specification | IEC 60512-3-1:2002-02 | 
| Insulation resistance, neighboring positions | 1012 Ω | 
Air clearances and creepage distances |
| Specification | IEC 60664-1:2007-04 | 
| Insulating material group | IIIa | 
| Comparative tracking index (IEC 60112) | CTI 250 | 
| Rated insulation voltage (III/3) | 32 V | 
| Rated surge voltage (III/3) | 1.5 kV | 
| minimum clearance value - non-homogenous field (III/3) | 0.8 mm | 
| minimum creepage distance (III/3) | 1.3 mm | 
| Rated insulation voltage (III/2) | 160 V | 
| Rated surge voltage (III/2) | 2.5 kV | 
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm | 
| minimum creepage distance (III/2) | 1.6 mm | 
| Rated insulation voltage (II/2) | 160 V | 
| Rated surge voltage (II/2) | 2.5 kV | 
| minimum clearance value - non-homogenous field (II/2) | 0.5 mm | 
| minimum creepage distance (II/2) | 1.6 mm | 
Vibration test
| Specification | IEC 60068-2-6:2007-12 | 
| Frequency | 10 - 150 - 10 Hz | 
| Sweep speed | 1 octave/min | 
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) | 
| Acceleration | 5g (60.1 Hz ... 150 Hz) | 
| Test duration per axis | 2.5 h | 
Durability test
| Specification | IEC 60512-9-1:2010-03 | 
| Impulse withstand voltage at sea level | 2.95 kV | 
| Contact resistance R1 | 2 mΩ | 
| Contact resistance R2 | 2.2 mΩ | 
| Insertion/withdrawal cycles | 25 | 
Climatic test
| Specification | ISO 6988:1985-02 | 
| Corrosive stress | 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle | 
| Thermal stress | 100 °C/168 h | 
| Power-frequency withstand voltage | 1.39 kV | 
Ambient conditions
| Ambient Temperature (Operation) | -40 °C ... 100 °C (dependent on the derating curve) | 
| Ambient temperature (storage/transport) | -40 °C ... 70 °C | 
| Relative humidity (storage/transport) | 30 % ... 70 % | 
| Ambient temperature (assembly) | -5 °C ... 100 °C | 
Packaging specifications
| Type of packaging | packed in cardboard | 
| Outer packaging type | Dry bag | 
Why Proax for Phoenix Contact 1963544?
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| Pack Size | 50 | 
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MCV 0,5/ 6-G-2,5 THT - PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads



















