The figure shows the 10-position version
Official DistributorSKU
MPN
MC 0,5/ 3-G-2,54 SMD R24
Weight
0.001 kg
Series MC
MC 0,5/ 3-G-2,54 SMD R24 - PCB header
PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MC 0,5/..-G-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 24 mm wide tape, Sample values available under SAMPLE MC...
- Designed for integration into the SMT soldering process
- Additional solder anchors reduce the mechanical strain on the soldering spots
- Gold-plated contacts ensure transfer quality remains stable over the long term
- Supplied in tape-on-reel packing according to IEC 60286-3 for automated mounting
Technical Specifications
Product properties
| Product family | MC 0,5/..-G-SMD |
| Product line | COMBICON Connectors XS |
| Number of Positions | 3 |
| Pitch | 2.54 mm |
| Number of Connections | 3 |
| Number of rows | 1 |
| Number of potentials | 3 |
| Mounting flange | without |
| Pin layout | Linear pad geometry |
| Solder pins per potential | 1 |
Electrical properties
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Degree of pollution | 3 |
| Contact resistance | 2.6 mΩ |
| Rated voltage (III/3) | 32 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 160 V |
| Rated surge voltage (II/2) | 2.5 kV |
Mounting
| Mounting Type | SMD soldering |
| Pin layout | Linear pad geometry |
Processing notes
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
Material data - contact
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact Material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.25 Au) |
| Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.25 Au) |
| Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
Material data - housing
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
Dimensions
| Pitch | 2.54 mm |
| Width [w] | 12.2 mm |
| Height [h] | 4.85 mm |
| Length [l] | 7.1 mm |
| Installed height | 4.85 mm |
| Pin dimensions | 0.64 x 0.64 mm |
PCB design
| Pad geometry | 1.2 x 2.06 mm |
| Hole diameter | 1.2 mm |
Visual inspection
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
Dimension check
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
Resistance of inscriptions
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
Polarization and coding
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
Contact holder in insert
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N | Test passed |
Insertion and withdrawal forces
| Result | Test passed |
| No. of cycles | 100 |
| Insertion strength per pos. approx. | 2 N |
| Withdraw strength per pos. approx. | 2 N |
Thermal test | Test group C
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 16 |
Insulation resistance
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
Air clearances and creepage distances |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 32 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 1.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 160 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.6 mm |
Vibration test
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 500 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 500 Hz) |
| Test duration per axis | 2 h |
Durability test
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 2.95 kV |
| Contact resistance R1 | 2.6 mΩ |
| Contact resistance R2 | 2.6 mΩ |
| Insertion/withdrawal cycles | 100 |
| Insulation resistance, neighboring positions | > 5 MΩ |
Climatic test
| Specification | DIN 50018:2013-05 |
| Corrosive stress | 1.0 dm3 SO2 on 300 dm3/40 °C/3 cycles |
| Thermal stress | 100 °C/168 h |
| Power-frequency withstand voltage | 1.39 kV |
Ambient conditions
| Ambient Temperature (Operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Type of packaging | 24 mm wide tape |
| [W] tape width | 24 mm |
| [W2] coil overall dimension | 30.4 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Accessories
1847928 - PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MC 0,5/..-G-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
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Additional Information
| Pack Size | 465 |
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