The figure shows a 10-position version of the product
1704929
Official DistributorSKU
PHX1704929
MPN
MCDNV 1,5/ 8-G1-3,5 P26THRGNAU
Weight
0.007 kg
Series MCDNV
MCDNV 1,5/ 8-G1-3,5 P26THRGNAU - PCB header
PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 16, number of rows: 2, number of positions: 8, number of connections: 16, product range: MCDNV 1,5/..-G1-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: no, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads
- Gold-plated contacts ensure transfer quality remains stable over the long term
- Designed for integration into the SMT soldering process
- Vertical connection enables multi-row arrangement on the PCB
- Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Technical Specifications
Product properties
| Product family | MCDNV 1,5/..-G1-THR |
| Product line | COMBICON Connectors S |
| Type | Component suitable for through hole reflow |
| Number of Positions | 8 |
| Pitch | 3.5 mm |
| Number of Connections | 16 |
| Number of rows | 2 |
| Number of potentials | 16 |
| Mounting flange | no |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
Electrical properties
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
Mounting
| Mounting Type | THR soldering |
| Pin layout | Linear pinning |
Material data - contact
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact Material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (1 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) |
Material data - housing
| Color (Housing) | green (6021) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
Notes
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
Dimensions
| Pitch | 3.5 mm |
| Width [w] | 29.5 mm |
| Height [h] | 13.3 mm |
| Length [l] | 16 mm |
| Installed height | 15.9 mm |
| Solder pin length [P] | 2.6 mm |
| Pin dimensions | 0.8 x 0.8 mm |
PCB design
| Pin spacing | 3.50 mm |
| Hole diameter | 1.3 mm |
Air clearances and creepage distances |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
Ambient conditions
| Ambient Temperature (Operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Type of packaging | packed in cardboard |
Why Proax for Phoenix Contact 1704929?
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Additional Information
| Pack Size | 40 |
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